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Liste des Conférences - Électronique 2014 2015

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MessageSujet: Liste des Conférences - Électronique 2014 2015 Sam 13 Sep 2014 - 7:37

INTELEC 2014 — 2014 IEEE International Telecommunications Energy Conference
 Dates     28 Sep 2014 → 02 Oct 2014    
[ID=573410] Haut de la page
 Lieu    Vancouver, BC, Canada
 Résumé     An international conference for users, designers, and manufacturers of communications energy systems for: Wireline and Wireless systems, Data/Internet systems, Video systems, SATCOM, CATV, VOIP, Unified Communications systems, WiFi, Data Centers, Energy Storage, Renewable Energy, and Smart Grid Systems.
 Page web     http://www.intelec.org
      
11.S3S — 2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
 Dates     06 Oct 2014 → 09 Oct 2014    
[ID=580103] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     This new unified conference will help us to improve our efficiency and establish this conference as a world class International venue to present and learn about the most up to date trends in CMOS and post-CMOS Scaling. The conference committee hopes you will enjoy this new conference that will give you more opportunities to learn and gain insight into the different contributions to the low-power SOC eco-system.
 Page web     http://s3sconference.org/
      
12.BIOMEIC'14 — Biomedical Engineering International Conference
 Dates     15 Oct 2014 → 16 Oct 2014    
[ID=613355] Haut de la page
 Lieu    Tlemcen, Algérie
 Résumé     The Biomedical Engineering International Conference BIOMEIC’14 will be held from 15-16 October in Tlemcen, Algeria. The aim of BIOMEIC’14 is to provide a convivial environment to scientists, researchers and industrials, in which they can exchange their scientific results. It offers also a convivial space and privileges discussions, meetings between researchers and industrials to present their latest researches on recent topics in different areas of biomedical engineering.
 Sujets     Physiological signal processing, Medical images processing, Biomedical Instrumentation, Biomedical Informatics, Technology of Information and Communication (TIC) in Health-Telemedicine
 Page web     http://www.univ-tlemcen.dz/biomeic14/
 Contact     BIOMEIC Secretariat, Biomedical Engineering research laboratory, University Aboubekr Belkaid, Tlemcen, Algeria; Tél.: [+213779037753]; Email.: biomeicsecretariat@gmail.com
 Sujets apparentés     Physique appliquée: Biophysique et génie biomédical
      
13.BTS — IEEE Broadcast Symposium
 Dates     15 Oct 2014 → 17 Oct 2014    
[ID=633083] Haut de la page
 Lieu    San Antonio, États-Unis
 Page web     http://bts.ieee.org/
 Sujets apparentés     Physique appliquée: Électrostatique et rayonnement électromagnétique
      
14.AUTOMATION 2014
 Dates     15 Oct 2014 → 18 Oct 2014    
[ID=590339] Haut de la page
 Lieu    Mumbai, Inde
 Résumé     Automation 2014 showcases a wide and comprehensive range of manufacturing and automation equipments and products which are used by almost all types of industrial sectors.
 Sujets     Factory Automation Process Automation & Control Systems Field Instrumentation & Smart Sensors Robotics & Drives Bus Technologies Software Solutions Wireless Technology Building Automation Hydraulics & Pneumatics Automation in Renewable Energy Safety and Security Systems
 Page web     http://www.iedcommunications.com
 Contact     Benedicta Andrew; Tél.: [91 22 28505138]; Email.: beni@iedcommunications.com
 Sujets apparentés     Robotique, automation & mécatronique; Ingénierie automobile et ferroviaire
      
15.CSISC — 2014 IEEE Compound Semiconductor Integrated Circuit Symposium
 Dates     19 Oct 2014 → 22 Oct 2014    
[ID=550737] Haut de la page
 Lieu    San Diego, Californie, États-Unis
 Résumé     CSICS is a technology and integrated circuit conference showcasing many of the finest achievements made in compound semiconductor technology and circuits. CSICS has grown to encompass GaAs, InP, GaN, SiGe, SiC, InSb, nano-scale CMOS, and graphene semiconductor technologies and their application to RF, mm-wave, high-speed, and energy conversion circuits and systems. Specific technical areas of interest include: Innovative device concepts in emerging technologies, Nitrides, InP, III-V on Si, Ge on Si, Graphene, Analog, RF, mixed-signal, mm-wave, THz circuit blocks and ICs in III-V, CMOS, SiGe BiCMOS, Power conversion circuits and technologies, Optoelectronic and photonic devices and ICs, System applications, Wireless handsets and base stations, Vehicular and military RADAR, High-speed digital systems, Fiber optics and photonics, Device and circuit modeling / EM and EDA tools, Thermal simulation and advanced packaging of highpower devices and ICs, Device and IC manufacturing processes
 Page web     http://www.csics.org
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
16.ITC — 2014 IEEE International Test Conference
 Dates     20 Oct 2014 → 23 Oct 2014    
[ID=573564] Haut de la page
 Lieu    Seattle, WA, États-Unis
 Résumé     ITC is the world's premier conference dedicated to electronic test technology, covering the complete cycle from design verification, test, diagnosis, failure analysis back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces and learn how these challenges have been addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.
 Page web     http://www.itctestweek.org/
 Sujets apparentés     Métrologie et instrumentation
      
17.SAE Convergence Conference & Exhibition
 Dates     21 Oct 2014 → 22 Oct 2014    
[ID=633462] Haut de la page
 Lieu    Detroit, États-Unis
 Résumé     For decades, the SAE Convergence Conference & Exhibition has brought together technology leaders from across the Globe to address the impact of electronics systems and the issues critical to mobility electronics implementation. This year features a compelling line-up focusing on the most relevant issues surrounding electronics technology.
 Page web     http://www.sae.org/events/convergence/
 Sujets apparentés     Ingénierie automobile et ferroviaire
      
18.ITC — IEEE International Test Conference
 Dates     21 Oct 2014 → 23 Oct 2014    
[ID=633504] Haut de la page
 Lieu    Seattle, États-Unis
 Résumé     International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification and validation, test (DFT, ATPG, and BIST), diagnosis, failure analysis and back to process, yield, reliability and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.
 Page web     http://www.itctestweek.org
 Sujets apparentés     Matériel informatique; Ingénierie
      
19.IMPACT — International Microsystems, Packaging, Assembly and Circuits Technology Conference
 Dates     22 Oct 2014 → 24 Oct 2014    
[ID=633620] Haut de la page
 Lieu    Taipei, Taiwan, Chine
 Page web     http://www.impact.org.tw/2014/General/
 Sujets apparentés     Matériel informatique
      
20.EPEPS — 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems
 Dates     26 Oct 2014 → 29 Oct 2014    
[ID=572064] Haut de la page
 Lieu    Portland, OR, États-Unis
 Résumé     EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.
 Page web     http://epeps.ece.illinois.edu
      
21.BIHTEL 2014 — X International Symposium on Telecommunications
 Dates     27 Oct 2014 → 29 Oct 2014    
[ID=617687] Haut de la page
 Lieu    Sarajevo, Bosnie-Herzégovine
 Résumé     X International Symposium on Telecommunications – BIHTEL 2014, organized by Faculty of Electrical Engineering Sarajevo, will be held in Sarajevo, Bosnia and Herzegovina, during October 27-29, 2014.
 Sujets     Communication and Information Theory, Signal Processing for Communications, Wireless and Radio Communications and Networking, Modelling and Simulation, Software-defined Networking and Virtualization, Management in Communication Systems and Networks, Next-Generation Networks, Communications Software Services and Multimedia Applications, Optical Networks, Communication and Information Systems, Security, Education in Communication Engineering,
 Page web     http://bihtel.etf.unsa.ba/bihtel-2014/cms/
 Contact     Tél.: [+(387) (33)250 734]; Email.: kturbic@etf.unsa.ba
 Sujets apparentés     Informatique mobile & télécommunications
      
22.ICRAMAV-2014 — International Conference on Recent Advances in Design, Development and Operation of Micro Air Vehicles
 Dates     05 Nov 2014 → 07 Nov 2014    
[ID=637908] Haut de la page
 Lieu    Hyderabad (Telangana), Inde
 Résumé     The Conference primarily focuses on important issues related to guidance, navigation, control, sensors, aerodynamics, system engineering, operations, legal aspects, fuselage & propulsion systems related to Unmanned Air Vehicles.
 Page web     http://icramavjntuh.com/
 Contact     Dr. M. Madhavi Lath, Director, Innovative Technologies , Jawaharlal Nehru Technological University Hyderabad ; Tél.: [+91 40 23158662,Mobile, +91 9848506611]; Email.: itc@jntuh.ac.in
 Sujets apparentés     Aviation & vol spatial; Robotique, automation & mécatronique
      
23.IPAS — International Image Processing, Applications and Systems Conference
 Dates     05 Nov 2014 → 07 Nov 2014    
[ID=650015] Haut de la page
 Lieu    Hammamet, Tunisie
 Résumé     The international Image Processing Applications and Systems conference is intended for grouping from all over the world challenging researchers, innovators, academicians, and practitioners in image processing theory and tools, for following high level tutorials, sharing their achievements, exchanging their experiences and discussing future orientations. The conference will also offer an opportunity to make a bridge between image processing researchers and people working in other application fields such as medical doctors, radiotherapists or industrial parts.
 Sujets     Image and Video Processing Theory Image and Video Processing Applications Computer Science and Imaging Real Time Image Processing
 Page web     http://www.ipas-ciels-univ-sfax.com
 Contact     IPAS’14 Organizing committee; Email.: ipas14@ipas-ciels-univ-sfax.com
 Sujets apparentés     Multimédia et infographie; Mathématiques appliquées: Reconnaissance de formes et traitement d'image
      
24.CENICS 2014 — The Seventh International Conference on Advances in Circuits, Electronics and Micro-electronics
 Dates     16 Nov 2014 → 20 Nov 2014    
[ID=600494] Haut de la page
 Lieu    Lisbonne, Portugal
 Organisateur     International Academy, Research and Industry Association (IARIA)
 Résumé     Colocated with other events part of NetWare 2014
 Page web     http://www.iaria.org/conferences.html
 Sujets apparentés     Matériel informatique
      
25.Electricity 2014 — The 15th International Annual Convention of the Society of Electrical and Electronics Engineers in Israel
 Dates     03 Dec 2014 → 06 Dec 2014    
[ID=629165] Haut de la page
 Lieu    Eilat, Israël
 Résumé     This year convention will be focusing, among the traditional topics, also the Penetration of the Smart Grid, the Neutral Gas Revolution and the Electricity Market Reform Plan.
 Sujets     Energy and Cyber Security, Energy Management, Control Systems, Energy Efficiency, Energy Systems in Buildings, Engineering Projects, Industrial Control, Lighting Systems , Operation and Maintenance of Electrical Facilities, Power Electronics, Power Generation Systems, Power Quality and Reliability, Testing, Measuring and Standardization, Trends and Innovations in Facilities and Electrical Systems
 Page web     http://electricity2014.com/
 Contact     Tamar Orkabi ; Tél.: [972-3-5767716]; Email.: torkabi@paragong.com
 Sujets apparentés     Électrotechnique
      
26.ISIC — 2014 International Symposium on Integrated Circuits
 Dates     10 Dec 2014 → 12 Dec 2014    
[ID=573451] Haut de la page
 Lieu    Singapore, Singapour
 Résumé     This conference will appeal to reseachers and practitioners of IC design and EDA tools.
 Page web     http://www.isic2014.org
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
27.ISSPIT 2014 — 2014 IEEE International Symposium on Signal Processing and Information Technology
 Dates     15 Dec 2014 → 17 Dec 2014    
[ID=635119] Haut de la page
 Lieu    Delhi, Inde
 Page web     http://www.computer.org/portal/web/conferences/calendar
 Sujets apparentés     Evénement multidisciplinaires ou générales en informatique
      
28.ISED 2014 — 5th International Symposium on Electronic System Design
 Dates     18 Dec 2014 → 20 Dec 2014    
[ID=619035] Haut de la page
 Lieu    Ajmer, Rajasthan, Inde
 Page web     http://www.computer.org/portal/web/conferences/calendar
      
29.SPACES — 2015 International Conference on Signal Processing And Communication Engineering Systems
 Dates     02 Jan 2015 → 03 Jan 2015    
[ID=635751] Haut de la page
 Lieu    GUNTUR, Inde
 Résumé     "International Conference on Signal Processing And Communication Engineering Systems 2015"will be held in K L University, Vijayawada,India on 2-3 Jan 2015. The aim of the conference is to provide a platform for Students, Engineers, Academicians, Researchers and Scientists who are involved in research in the field of Advanced Signal Processing Applications to contribute and to disseminate the innovative and important new work. The Conference provides a leading forum for sharing original research contributions and practical development experiences among researchers and application developers. The primary goal of the conference is to promote research and developmental activities by understanding what others have achieved successfully in their respective applications and "translocation" those ideas into another field could help speedup what we need to achieve ourselves in our respective domains.
 Page web     http://spaces-2015.webs.com/
      
30.ICCE — 2015 IEEE International Conference on Consumer Electronics
 Dates     09 Jan 2015 → 12 Jan 2015    
[ID=635940] Haut de la page
 Lieu    Las Vegas, NV, États-Unis
 Résumé     Key technologies, products, services and architectures for consumer entertainment and information delivery are first seen at ICCE
 Page web     http://www.icce.org
      
31.RWS — 2015 IEEE Radio and Wireless Symposium
 Dates     25 Jan 2015 → 28 Jan 2015    
[ID=580676] Haut de la page
 Lieu    San Diego, Californie, États-Unis
 Résumé     This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today s design compromises can trigger tomorrow s advanced technologies. Where dreams can become a reality.
 Page web     http://www.radiowirelessweek.org/
 Sujets apparentés     Informatique mobile & télécommunications
      
32.PAWR — 2015 IEEE Topical Conference on Power Amplifiers for Wireless and Radio Applications
 Dates     25 Jan 2015 → 28 Jan 2015    
[ID=580708] Haut de la page
 Lieu    San Diego, Californie, États-Unis
 Résumé     Power amplifiers are often the most critical component of RF/microwave communications systems and consequently the focus of intense research to achieve increased linearity and power efficiency. This conference reviews the new forms of power amplification that are being developed to meet the needs of the wireless communication equipment industry and the world s demand for greater information transmission.
 Page web     http://www.radiowirelessweek.org/pawr/
 Sujets apparentés     Informatique mobile & télécommunications
      
33.SiRF — 2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
 Dates     25 Jan 2015 → 28 Jan 2015    
[ID=585776] Haut de la page
 Lieu    San Diego, Californie, États-Unis
 Résumé     Silicon-based devices, passives, integrated circuits, and applications for high frequency systems.
 Page web     http://www.silicon-rf.org/sirf2015
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
34.EDCAV — 2015 International Conference on Electronic Design, Computer Networks & Automated Verification
 Dates     29 Jan 2015 → 30 Jan 2015    
[ID=635902] Haut de la page
 Lieu    Shillong, Inde
 Résumé     The aim of the conference is to provide a platform for engineers to disseminate and discuss their current research findings and also to explore recent development, current practices and future trends in Electronics, Communications and Computers. We also encourage the dissemination of R&D linked to the Industry. The conference program includes sessions with invited speakers and breakout sessions with oral, poster and demo presentations in the fields of Electronics, Communications and Computers.
 Page web     http://www.edcav.org
 Sujets apparentés     Matériel informatique
      
35.EI15 — IS&T / SPIE Electronic Imaging 2015
 Dates     08 Fév 2015 → 12 Fév 2015    
[ID=625396] Haut de la page
 Lieu    San Francisco, États-Unis
 Résumé     IS&T/ SPIE Electronic Imaging is the best global audience for digital imaging systems, 3D imaging, image quality, and image processing. It is the must attend event for all aspects of electronic imaging, from imaging systems to instrumentation to image processing to algorithms. Topics include digital imaging, sensors and applications, 3D Imaging, multimedia, image processing, visualization and perception, and visual communications. Oral and interactive paper presentations are encouraged on CCD, CMOS sensors, digital photography, color hardcopy, human vision, image processing and compression, stereoscopic displays, image quality, and multimedia imaging systems.
 Sujets     3d imaging processing, stereoscopic displays, video surveillance, color imaging, video processing, computational imaging, image sensors, image systems, mobile devices and multimedia
 Page web     http://electronicimaging.org/?WT.mc_id=REICAW
 Contact     Customer Service ; Tél.: [(360) 676-3290]; Email.: customerservice@spie.org
 Sujets apparentés     Mathématiques appliquées: Reconnaissance de formes et traitement d'image; Opto-électronique et technique d'affichage
      
36.ISSCC — 2015 IEEE International Solid- State Circuits Conference
 Dates     22 Fév 2015 → 26 Fév 2015    
[ID=573522] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     foremost forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and use to maintain technical currency, and to network with leading experts.
 Page web     http://www.isscc.org/isscc/futureisscc.htm
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
37.APEC — 2015 IEEE Applied Power Electronics Conference and Exposition
 Dates     15 Mar 2015 → 19 Mar 2015    
[ID=572575] Haut de la page
 Lieu    Charlotte, NC, États-Unis
 Résumé     APEC focuses on the practical and applied aspects of the power electronics business for equipment OEMs, component manufacturers and designers of power supplies, dc-dc converters, motor drives, UPSs, solar, renewable energy, inverters and any other power electronic circuits, equipments and systems.
 Page web     http://www.apec-conf.org/
      
38.ICIT 2015 — 2015 IEEE International Conference on Industrial Technology
 Dates     17 Mar 2015 → 19 Mar 2015    
[ID=622138] Haut de la page
 Lieu    Séville, Espagne
 Résumé     IEEE ICIT is one of the flagship yearly conferences of the IEEE Industrial Electronics Society, devoted to the dissemination of new ideas, research and works in progress within the fields of intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, vision systems, and power electronics. IEEE ICIT 2015 will be held in Seville, Spain, from March 17th to 19th, 2015. Seville is well connected to the world by an international airport, a high speed train, four motorways, and a river port, and contains the longest bycicle track system in Europe. Touristic attractions include historic district with the gothic Cathedral and the Arabic Palace Alcazar, Baroque churches, a theme park, river cruises, and nearby National Parks and beaches. Seville combines a rich historical past, when it was the main gate to Europe from the Americas, with a vibrant present as a technological center and meeting point.
 Sujets     Control Systems, Robotics and Mechatronics Power Electronics and Renewable Energy Conversion Power Systems and the Smart Grid Sensors, Actuators and Micro-nanotechnology Signal Processing and Computational Intelligence Electronic System on Chip and Embedded Control Electrical Machines and Drives Industrial Automation, Communication and Informatics Education and E-Learning in Electronics
 Page web     http://www.icit2015.org
 Contact     Antonio Luque; Tél.: [+34954481297]; Email.: aluque@ieee.org
 Sujets apparentés     Électrotechnique; Robotique, automation & mécatronique
      
39.ISISS — 2015 IEEE International Symposium on Inertial Sensors and Systems
 Dates     23 Mar 2015 → 26 Mar 2015    
[ID=636105] Haut de la page
 Lieu    Waimea, HI, États-Unis
 Résumé     The IEEE ISISS has an ambition to establish itself as the premier forum for reporting the latest research, development, and commercialization results in modern Inertial Sensors and Systems. Talks on materials and micro-fabrication processes, innovative designs, and new physical principals will be held, and there will be a growing number of new applications and business opportunities.
 Page web     http://www.ieee-isiss.org
 Sujets apparentés     Métrologie et instrumentation; Microtechnologie, nanotechnologie
      
40.ICMTS — 2015 International Conference on Microelectronic Test Structures
 Dates     23 Mar 2015 → 26 Mar 2015    
[ID=636384] Haut de la page
 Lieu    Tempe, AZ, États-Unis
 Résumé     The Conference presents new developments in test structures, their implementation, and/or application in the fields of silicon, compound semiconductor, nanotechnology, and MEMS research, including their implementation and applications, as well as test structures aimed at the characterization of new materials and devices.
 Page web     http://www.see.ed.ac.uk/ICMTS
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
41.IWS — 2015 IEEE International Wireless Symposium
 Dates     30 Mar 2015 → 01 Avr 2015    
[ID=636220] Haut de la page
 Lieu    Shenzhen, Chine
 Résumé     The Third IEEE MTT-S International Wireless Symposium (IWS 2015) will be held 30 March – 1 April 2015 in Shenzhen, China. This conference is held annually in China to provide an international forum for the presentation and exchange of the latest technical achievements in microwave circuits and hardware and RF systems related to the physical layer aspects of the existing and emerging wireless systems including but not limited to RFID, UWB, 802.15.4, WiGig, ZigBee, 6LoWPAN, Wireless HART, WiMi, WISA, Bluetooth, MIMO, WiMax, 5G and others. IWS 2015 will feature parallel session tracks, workshops and short courses, and technology exhibition showcasing the latest wireless commercial products.
 Page web     http://www.iws-ieee.org
      
42.WAMICON — 2015 IEEE 16th Annual Wireless and Microwave Technology Conference
 Dates     12 Avr 2015 → 15 Avr 2015    
[ID=636499] Haut de la page
 Lieu    Cocoa Beach, FL, États-Unis
 Résumé     The conference addresses up-to-date multidisciplinary research needs and interdisciplinary aspects of wireless and RF technologies. Content includes cognitive radio, 5G and advanced data networks, UWB, MIMO, power amplifiers and modeling, point-to-point and point-to-multipoint systems.
 Page web     http://www.wamicon.org
 Sujets apparentés     Informatique mobile & télécommunications
      
43.SPIE Optics + Optoelectronics 2015
 Dates     13 Avr 2015 → 16 Avr 2015    
[ID=639467] Haut de la page
 Lieu    Prague, République tchèque
 Résumé     SPIE Optics + Optoelectronics is a meeting that highlights the technologies that drive Europe’s largest optoelectronic infrastructure projects, such as HiPER, HiLASE, ELI Beamlines, plus conferences and workshops on laser acceleration, FELs, X-ray and EUV optics, nonlinear optics, and more.
 Sujets     Metamaterials, Nonlinear Optics and Applications, Photon Counting Applications, Quantum Optics and Quantum Information Transfer and Processing, Optical Sensors, Micro-structured and Specialty Optical Fibres, Holography: Advances in Classical Holography and Modern Trends, Harnessing Relativistic Plasma Waves as Novel Radiation Sources from Terahertz to X-rays , EUV and X-ray Optics: Synergy between Laboratory and Space, Damage to VUV, EUV, and X-ray Optic, Advances in X-ray Free-Electron Laser Instrumentation, High-Power, High-Energy, and High-Intensity Laser Technology, Medical Applications of Laser Generated Beams of Particles, Laser Acceleration of Electrons, Protons and Ions, Research Using Extreme Light: Entering New Frontiers with PW-Class Lasers, Laser Energy Workshop, Integrated Optics: Physics and Simulations
 Page web     http://spie.org/optics-optoelectronics.xml?WT.mc_id=REOOCAW
 Contact     SPIE Europe ; Tél.: [+44 29 2089 4747]; Email.: info@spieeurope.org
 Sujets apparentés     Optique et lasers; Opto-électronique et technique d'affichage
      
44.ICNS — 2015 Integrated Communication, Navigation, and Surveillance Conference
 Dates     19 Avr 2015 → 24 Avr 2015    
[ID=579930] Haut de la page
 Lieu    Herdon, VA, États-Unis
 Résumé     New reserach, development and implementation programs and policies related to ICNS data link communications, ADS-B, SWIM, airport surface communications, spectrum constraints, transition to digital communications, surveillance systems integration, satellite-based navigation, integration, avionics equipage, secure airborne networking, unmanned aircraft integration into the airspace, NextGen, SESAR, and new commercial aircraft integration and operation, airspace management.
 Page web     http://i-cns.org
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MessageSujet: Re: Liste des Conférences - Électronique 2014 2015 Sam 13 Sep 2014 - 7:38

IVEC — 2015 IEEE International Vacuum Electronics Conference
 Dates     27 Avr 2015 → 29 Avr 2015    
[ID=635452] Haut de la page
 Lieu    Pékin, Chine
 Résumé     IVEC was originally created in 2000 and has now expanded to a fully international conference for vacuum electronic device and system professionals. IVEC2015 is organized by IEEE Beijing Section, Beijing Vacuum Electronics Research Institute and National Key Laboratory of Science and Technology on Vacuum Electronics. It will commence with an inaugural and plenary sessions including talks by eminent experts to focus onto the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current and future directions in vacuum electronics research. Subsequently, a number of parallel oral and poster sessions will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, present latest developments in theories and computational design tools, active and passive components, systems, and supporting technologies.
 Page web     http://cie-china.org/ivec2015
      
46.VLSI-DAT — 2015 International Symposium on VLSI Design, Automation and Test
 Dates     27 Avr 2015 → 29 Avr 2015    
[ID=635761] Haut de la page
 Lieu    Hsinchu, Taïwan
 Résumé     RF, analog and mixed-signal circuits Sensors and interface circuits Digital circuits and ASIC CPU, DSP and multicore architectures Memory circuits and systems Low power logic and architectures Multimedia processing circuits Communication circuits Embedded systems and software Designs using novel technologies System-in-package design Electronic System Level Design Modeling and simulation Hardware-software co-design Logic and architecture synthesis
 Page web     http://vlsidat.itri.org.tw/
 Sujets apparentés     Matériel informatique
      
47.CCECE — 2015 IEEE 28th Canadian Conference on Electrical and Computer Engineering
 Dates     03 Mai 2015 → 06 Mai 2015    
[ID=573080] Haut de la page
 Lieu    Halifax, NS, Canada
 Page web     http://www.ieee.ca/ccece15
 Sujets apparentés     Evénement multidisciplinaires ou générales en informatique
      
48.ISNE — 2015 International Symposium on Next-Generation Electronics
 Dates     04 Mai 2015 → 06 Mai 2015    
[ID=635601] Haut de la page
 Lieu    Taipei, Taïwan
 Résumé     The 4th ISNE conference welcomes scientific papers in the field of Computer systems and applications, Processor design, Computer networks, Electronic design automation, Multimedia systems and applications, Education in computer science and engineering, Sensor systems, Communication systems, Power electronics, Biomedical circuits and systems, Image processing, IC & IC Packaging, Photovoltaic, materials, devices and systems, Nanomaterials, Micro/Nanofabrication, Semiconductor lasers and LEDs, Photonic and optical devices, Display technology, Fiber optics and fiber sensing, Photonic communications, and Solid state lighting technology.
 Page web     http://isne2015.ntust.edu.tw
      
49.ISPSD — 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's
 Dates     10 Mai 2015 → 14 Mai 2015    
[ID=636279] Haut de la page
 Lieu    Hong Kong, Chine
 Résumé     Power electronics
 Page web     http://www.ispsd2015.com
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
50.ISCAS — 2015 IEEE International Symposium on Circuits and Systems
 Dates     24 Mai 2015 → 27 Mai 2015    
[ID=636259] Haut de la page
 Lieu    Lisbonne, Portugal
 Résumé     The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world's premier networking forum in the highly active fields of theory, design and implementation of circuits and systems. ISCAS 2015 will have a special focus on Enabling Technologies for Societal Challenges, and seeks to address multidisciplinary challenges as circuits and systems using microelectronics, nanotechnologies and biotechnologies to address health, demographic change, wellbeing, security and sustainability issues.
 Page web     http://www.iscas2015.org
      
51.APEMC — 2015 Asia-Pacific Symposium on Electromagnetic Compatibility
 Dates     26 Mai 2015 → 29 Mai 2015    
[ID=635866] Haut de la page
 Lieu    Taipei, Taïwan
 Résumé     The symposium aims to share recent advances in all aspects of EMC in the Asia-Pacific region, to respond the EMC requirements for all rising technologies, and to closely link up the international EMC community. The symposium will cover the entire scope of EMC; especially, it will offer a rich technical program of highest quality, lectures presented by distinguished speakers from all over the world, and a broad forum for interacting between academia and industry.
 Page web     http://www.apemc2015.org
      
52.ECTC — 2015 IEEE 65th Electronic Components and Technology Conference
 Dates     02 Jui 2015 → 05 Jui 2015    
[ID=572817] Haut de la page
 Lieu    San Diego, Californie, États-Unis
 Résumé     ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
 Page web     http://www.ectc.net
      
53.WoW — 2015 IEEE PELS Workshop on Emerging Technologies: Wireless Power
 Dates     05 Jui 2015 → 06 Jui 2015    
[ID=635781] Haut de la page
 Lieu    Daejeon, Corée du Sud
 Résumé     Wireless powers for mobile devices (smart phones, tablet PC, etc.) Wireless powers for electric vehicles (PHEV, BEV, RPEV; bus, train, etc.) Wireless powers for home appliances Wireless powers for industry applications Wireless powers for medical and defense applications Converters for wireless powers Analytical methods for wireless powers Environmental impacts of wireless powers Magnetics and coil designs for wireless powers Components and EMC designs for wireless powers Modeling, simulation, and control of wireless power systems
 Page web     http://www.2015wow.org/
      
54.DAC — 2015 52nd ACM/EDAC/IEEE Design Automation Conference
 Dates     08 Jui 2015 → 12 Jui 2015    
[ID=572661] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
 Page web     http://www.dac.com
      
55.2015 IEEE 11th International Conference on Power Electronics and Drive Systems
 Dates     09 Jui 2015 → 12 Jui 2015    
[ID=573284] Haut de la page
 Lieu    Sydney, Australie
 Résumé     The conference opens up an opportunity for academics and industrial professionals worldwide to exchange their knowledge of the state-of-the-art power electronics and drive technologies and applications. The programme will feature on tutorials and technical paper presentations. The range of technical topics includes but not limited to: Power semiconductors, Power integrated circuits (PIC), passive components and packaging technologies Motor drives and motion control Analysis and design of electrical machines Hard-switching and soft-switching static power converters and UPS Applications of power electronics in power system and generation/FACTS Power quality issues, harmonic problems and solutions EMI/EMC issues Traction and automotive systems Applications of power electronics in home appliance, industry and aerospace Renewable energy technologies Distributed generation and smart-grid Modelling and simulation in power electronics
 Page web     http://www.ieee-peds.org
 Sujets apparentés     Électrotechnique
      
56.BMSB — 2015 IEEE International Symposium on Broadband Multimedia Systems and Broadcasting
 Dates     17 Jui 2015 → 19 Jui 2015    
[ID=636465] Haut de la page
 Lieu    Gand, Belgique
 Résumé     The presentation and exchange of technical advances in the rapidly converging areas of multimedia broadcasting, telecommunications, consumer electronics, and networking technologies
 Page web     http://www.wica.intec.ugent.be/bmsb2015/
 Sujets apparentés     Informatique mobile & télécommunications
      
57.CPE — 2015 9th International Conference on Compatibility and Power Electronics
 Dates     24 Jui 2015 → 26 Jui 2015    
[ID=635763] Haut de la page
 Lieu    Caparica, Portugal
 Résumé     In the field of electrical engineering, power electronics is being dynamically developed, finding its application in several industrial branches. Many production technologies became more efficient, when applying power electronics equipment. Power electronics and energy systems integration provide high standards of human friendly environment. The next generation of power electronics systems must change environmental factors, customer concerns and reliability. International Conference on Compatibility and Power Electronics is an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems. The first conference of the International Conference-Workshop on Compatibility and Power Electronics series was first held in 1999. From its beginning the objective of CPE has been to offer a wide forum of discussion to power electronics specialists.
 Page web     http://sites.uninova.pt/cpe2015
 Sujets apparentés     Électrotechnique
      
58.IMWS-AMP — 2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications
 Dates     01 Jul 2015 → 03 Jul 2015    
[ID=636336] Haut de la page
 Lieu    Suzhou, Chine
 Résumé     Carbon nanotubes and 2D electronic and optoelectronic devices (e.g. graphene and beyond graphene- Wide bandgap and other emerging semiconductor materials (e.g. ionic)-pin-wave and magnonic crystal materials â-gineered metamaterials and plasmonics for absorption, cloaking, and wave manipulation- Ferromagnetic materials and superconducting materia-Advanced silicon, integrated passive devices (IPD) and through silicon via (TSV) Ã-CC, LCP, large area printing and inkjet printing -3D printing - Passive/active microwave and terahertz devices (material characterization, fabrications, and applications)- Antennas with advanced/complex/artificial materials and processes
 Page web     http://www.nusri.cn/imws-amp2015
      
59.EMC 2015 — 2015 IEEE International Symposium on Electromagnetic Compatibility
 Dates     16 Aou 2015 → 22 Aou 2015    
[ID=572865] Haut de la page
 Lieu    Dresden, Allemagne
 Résumé     The EMC 2015 provides an excellent forum for presentation, discussion and exchange of the latest EMC problems and solutions from universities, research laboratories and industry.
 Page web     http://www.emc2015.org
      
60.EPE ECCE-Europe — 2015 IEEE 17th European Conference on Power Electronics and Applications
 Dates     07 Sep 2015 → 11 Sep 2015    
[ID=635912] Haut de la page
 Lieu    Genève, Suisse
 Résumé     Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for the smarter grid, energy efficiency, technologies for sustainable energy systems, converters and power supplies
 Page web     http://www.epe2015.com
      
61.ITC — 2015 IEEE International Test Conference
 Dates     06 Oct 2015 → 08 Oct 2015    
[ID=635632] Haut de la page
 Lieu    Anaheim, CA, États-Unis
 Résumé     International Test Conference, the cornerstone of TestWeek events, is the world's premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.
 Page web     http://itctestweek.org
      
62.CSICS — 2015 IEEE Compound Semiconductor Integrated Circuit Symposium
 Dates     11 Oct 2015 → 14 Oct 2015    
[ID=635860] Haut de la page
 Lieu    New Orleans, LA, États-Unis
 Résumé     CSICS is a technology and integrated circuit conference showcasing many of the finest achievements made in compound semiconductor technology and circuits. CSICS has grown to encompass GaAs, InP, GaN, SiGe, SiC, InSb, nano-scale CMOS, and graphene semiconductor technologies and their application to RF, mm-wave, high-speed, and energy conversion circuits and systems. Specific technical areas of interest include: Innovative device concepts in emerging technologies, Nitrides, InP, III-V on Si, Ge on Si, Graphene, Analog, RF, mixed-signal, mm-wave, THz circuit blocks and ICs in III-V, CMOS, SiGe BiCMOS, Power conversion circuits and technologies, Optoelectronic and photonic devices and ICs, System applications, Wireless handsets and base stations, Vehicular and military RADAR, High-speed digital systems, Fiber optics and photonics, Device and circuit modeling / EM and EDA tools, Thermal simulation and advanced packaging of high power devices and ICs, Device and IC manufacturing processes.
 Page web     http://www.csics.org
 Sujets apparentés     Matériel informatique; Physique de la matière condensée: Semi-conducteurs
      
63.Holm 2015 — 2015 IEEE 61st Holm Conference on Electrical Contacts
 Dates     11 Oct 2015 → 14 Oct 2015    
[ID=635932] Haut de la page
 Lieu    San Diego, Californie, États-Unis
 Résumé     Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects that makes this conference so attractive to the practicing engineer. Additionally, the joint conference will make it possible for any attendee to discuss with other international authors, on work presented by the author at the conference or any subject related to the author s field of expertise.
 Page web     http://www.ewh.ieee.org/soc/cpmt/tc1/h2011/h2011intro.html
 Sujets apparentés     Physique de la matière condensée et des matériaux; Électrotechnique
      
64.JIEEEC — 2015 9th Jordanian International Electrical and Electronics Engineering Conference
 Dates     12 Oct 2015 → 14 Oct 2015    
[ID=636252] Haut de la page
 Lieu    Amman, Jordanie
 Résumé     JIEEEC is the ninth in series of annual conferences
 Page web     http://www.jeaconf.org/jieeec
 Sujets apparentés     Électrotechnique
      
65.IEDM — 2015 IEEE International Electron Devices Meeting
 Dates     07 Dec 2015 → 09 Dec 2015    
[ID=487241] Haut de la page
 Lieu    Washington, DC, États-Unis
 Résumé     IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc.
 Page web     http://www.ieee-iedm.org
      
66.ISSCC — 2016 IEEE International Solid- State Circuits Conference
 Dates     31 Jan 2016 → 04 Fév 2016    
[ID=573532] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     foremost forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and use to maintain technical currency, and to network with leading experts.
 Page web     http://www.isscc.org/isscc/futureisscc.htm
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
67.APEC — 2016 IEEE Applied Power Electronics Conference and Exposition
 Dates     19 Mar 2016 → 24 Mar 2016    
[ID=573961] Haut de la page
 Lieu    Long Beach, CA, États-Unis
 Résumé     APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to the practicing power electronics engineer.
 Page web     http://www-apec.conf.org
 Sujets apparentés     Électrotechnique
      
68.MTT 2016 — 2016 IEEE/MTT-S International Microwave Symposium
 Dates     22 Mai 2016 → 27 Mai 2016    
[ID=573380] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.
 Page web     http://www.ims2016.org
 Sujets apparentés     Physique appliquée: Électrostatique et rayonnement électromagnétique
      
69.ISSCC — 2017 IEEE International Solid- State Circuits Conference
 Dates     05 Fév 2017 → 09 Fév 2017    
[ID=573471] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     The International Solid-State Circuits Conference is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS IC's.
 Page web     http://www.isscc.org
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
70.DAC — 2017 54th ACM/EDAC/IEEE Design Automation Conference
 Dates     19 Jui 2017 → 23 Jui 2017    
[ID=572704] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
 Page web     http://www.dac.com
      
71.IEDM — 2017 IEEE International Electron Devices Meeting
 Dates     04 Dec 2017 → 06 Dec 2017    
[ID=520737] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
 Page web     http://www.ieee-iedm.org
      
72.ISSCC — 2018 IEEE International Solid- State Circuits Conference
 Dates     04 Fév 2018 → 08 Fév 2018    
[ID=573470] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs
 Page web     http://www.isscc.org
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
73.ECTC — 2018 IEEE 68th Electronic Components and Technologies Conference
 Dates     29 Mai 2018 → 01 Jui 2018    
[ID=572805] Haut de la page
 Lieu    San Diego, Californie, États-Unis
 Résumé     ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation
 Page web     http://www.ectc.net
      
74.DAC — 2018 55th ACM/EDAC/IEEE Design Automation Conference
 Dates     04 Jui 2018 → 08 Jui 2018    
[ID=572692] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
 Page web     http://www.dac.com
      
75.ISSCC — 2019 IEEE International Solid- State Circuits Conference
 Dates     02 Fév 2019 → 06 Fév 2019    
[ID=573513] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.
 Page web     http://www.isscc.org
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
76.IEDM — 2019 IEEE International Electron Devices Meeting
 Dates     09 Dec 2019 → 11 Dec 2019    
[ID=520714] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
 Page web     http://www.ieee-iedm.org
      
77.ISSCC — 2020 IEEE International Solid- State Circuits Conference
 Dates     02 Fév 2020 → 06 Fév 2020    
[ID=573578] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.
 Page web     http://www.isscc.org
 Sujets apparentés     Physique de la matière condensée: Semi-conducteurs
      
78.ECTC — 2020 IEEE 70th Electronic Components and Technology Conference
 Dates     26 Mai 2020 → 29 Mai 2020    
[ID=572859] Haut de la page
 Lieu    Orlando, FL, États-Unis
 Résumé     ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
 Page web     http://www.ectc.net
      
79.DAC — 2020 57th ACM/EDAC/IEEE Design Automation Conference
 Dates     01 Jui 2020 → 05 Jui 2020    
[ID=572724] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
 Page web     http://www.dac.com
      
80.ECTC — 2021 IEEE 71st Electronic Components and Technologies Conference
 Dates     01 Jui 2021 → 04 Jui 2021    
[ID=572781] Haut de la page
 Lieu    San Diego, Californie, États-Unis
 Résumé     ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
 Page web     http://www.ectc.net
      
81.DAC — 2021 58th ACM/EDAC/IEEE Design Automation Conference
 Dates     07 Jui 2021 → 11 Jui 2021    
[ID=572778] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
 Page web     http://www.dac.com
      
82.IEDM — 2021 IEEE International Electron Devices Meeting
 Dates     13 Dec 2021 → 15 Dec 2021    
[ID=520735] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
 Page web     http://www.ieee-iedm.org
      
83.DAC — 2022 59th ACM/EDAC/IEEE Design Automation Conference
 Dates     06 Jui 2022 → 10 Jui 2022    
[ID=572733] Haut de la page
 Lieu    San Francisco, CA, États-Unis
 Résumé     The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
 Page web     http://www.dac.com
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